New Report Offers Hope for Embedded  Components   (javascript:void 
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window.open('http://circuitsassembly.com/cms/index2.php?option=com_content&task=emailform&id=6022', 'win2', 
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nubar=no,resizable=yes,width=400,height=250,directories=no,location=no');)     By Mike  Buetow      Monday, 21 January 
2008   BANNOCKBURN, IL – A new report  on silicon-on-chip and system-in-package 
integration identifies embedded  components as a key emerging technology in 
component and product  miniaturization. The research, by Prismark Partners,  
looks at the impact of miniaturization on the supply chain and  how it drives 
certain technology and business shifts. It also  forecasts technology needs and 
market opportunities for all electronic  interconnects segments. 

The report focuses on three major  end-product industries – PCs, handheld 
electronics, and datacom/telecom  infrastructure equipment. It also addresses 
leading OEMs’ technology  roadmap requirements, according to IPC, which  
commissioned the report. 

The report, “Microelectronics: The Future  of Miniaturization and its Impact 
on Electronics Manufacturing,” is  available from IPC. 



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