EMBEDDEDNET Archives

May 2004

EmbeddedNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: IPC EPUG Teleconference
From:
柴田 明一 <[log in to unmask]>
Reply To:
D-37 Sub-Committee Forum <[log in to unmask]>, 柴田 明一 <[log in to unmask]>
Date:
Thu, 27 May 2004 09:42:39 +0900
Content-Type:
text/plain
Parts/Attachments:
text/plain (35 lines) 
It is my regret that I cannot join to the meeting.

Aki Shibata/JPCA

-----Original Message-----
From: Susan Filz [mailto:[log in to unmask]]
Sent: Friday, May 21, 2004 5:05 AM
To: [log in to unmask]
Subject: [EM] IPC EPUG Teleconference

Dear Colleagues:

The IPC Embedded Passives Users Group will be having a teleconference
Thursday, June 3 at 1:00 pm Central time. The call in number is
620-584-8200. The PIN is 1546.



Please join us for "Advantages of Thin Laminate Buried Capacitance
Constructions for High Speed PCB Applications," presented by Nick Biunno
and George Dudnikov of Sanmina SCI.



Please let me know if you have any questions, I can be reached at
[log in to unmask]



Thanks,

Susan Filz

Manager, IPC Industry Programs

ATOM RSS1 RSS2