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Date: | Fri, 21 Apr 2006 08:24:31 -0400 |
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Dan,
If the build were with glass laminate, I would agree on the cut outs.
However, with construction using polymer layers, a die cut (or laser cut)
should be little problem.
On the discrete component side, the 0402 size is quite large. I had
thought that 0201s or 01005 components would be required inside the board.
I think there are Japanese components now available in metric that are
smaller than the 01005 (10 mils by 5 mils). Since 10 mils by 5 mils is
250 microns by 125 microns, I will try to check to see if the 0402
designation in the article is some metric size discrete.
Denny Fritz
Daniel Brandler <[log in to unmask]>
Sent by: EmbeddedNet <[log in to unmask]>
04/20/2006 01:27 PM
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Re: [EM] "Inserted" embedded components - slides for today's discussion
Dennis,
Thanks for the info. I don't think that the technology for inserting
components into PCBs is a "threat" to embedded passives. The designs
look like a very expensive constructions. Except for "inserting known
good dies," I doubt that sequentially built PCBs with "cutouts" will be
cost competitive with conventional multilayer PCBs and embedded passive
components. Furthermore, a 1005 size limit (0402 to us) is not small
enough. They will have to do better than that.
Best regards,
Daniel Brandler
Ohmega Technologies, Inc.
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