Begin forwarded message:

> From: Michael Weinhold <[log in to unmask]>
> Date: February 8, 2012 10:25:16 GMT+01:00
> To: D-50 Embedded Devices Committee Forum <[log in to unmask]>, "Viklund, Per" <[log in to unmask]>
> Cc: Michael Weinhold <[log in to unmask]>
> Subject: Re: [EM] Fw: MILAERO007: What Became of the Embedded Passive Boom?
> 
> Dear Experts,
> 
> During the EIPC Winter Conference in Prague, on Feb. 2 and 3, 2012, embedding was a hot topic.
> The automotive industry sees an absolute need to meet the goals for improved reliability, miniaturization and cost reduction.
> Standard active and passive devices are embedded. Europe and Japan are very much in the driver seat for the embedding technology.
> Hofmann Leiterplatten in Germany filed a patent in 1996 and it was granted in 2004. See details in the paper published at the Electronic Circuit World Convention in Taiwan in Nov. 2011
> AT&S has purchased the patent end of 2011.  This is an important step for a proven approach into the embedding technology using PCB (organic) material.
> During the conference the keynote presenter explained the leading role Europe in making the embedding technology more accepted at the leading automotive design center around the world.
> The most comprehensive information on embedding and testing are coming from Japan. 
> Standard on Device Embedded Substrate
> Terminology Reliability Test/Design Guide
> -Edition 4.0-
> JPCA-EB01 (2011)
> 
> The version in the second edition are supplied as a IEC standard Proposal for embedding devices in PCB.  A copy of this can be ordered through the EIPC kwestenbergeipc.org.  More details you will find on the Web: http://campaign.r20.constantcontact.com/render?llr=yyotzndab&v=001dTY-NYldfV0MeV9dd7Dzv5NBjZJP8_mQbImLLAQXe-CLp2c1qFJ3pREwnLTBX7bMzl-wSnEsixsYc7JkIJ8fFFMc464jeq65N5Mvkb7Qn4g%3D
> 
> See you in San Diego at APEX 2012
> Best regards
> 
> Michael Weinhold
> 
> 
> 
> On Feb 8, 2012, at 9:50 , Viklund, Per wrote:
> 
>> Hi Lionel,
>> When you say the boom is still there, are you talking about enbedded thin/thick-film resistors or embedded decoupling capacitance?
>> ...or both?
>> 
>> /per viklund
>> 
>> 
>> 
>> 8 feb 2012 kl. 03:15 skrev "Lionel Fullwood" <[log in to unmask]>:
>> 
>>> HI ALl:
>>> 
>>> This is from Lionel at WKK in Hong Kong.
>>> 
>>> THE BOOM IS STILL THERE!   It is just that those involved are not openly 
>>> discussing it, as there is a definite market advantage for smart users!
>>> 
>>> Lionel.
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> 
> Michael Weinhold
> EIPC Technical Director
> European Institute of Printed Circuits
> Bourgognestraat 16
> P.O.Box 2060
> NL-6201CD Maastricht
> Office Phone: +31 43 3440872;  Direct Phone: +49 2223 708639
> Fax: +31 43 3440873;  Direct Fax: +49 2223 700896
> 
> E-Mail: [log in to unmask]
> Web: www.eipc.org
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> 

Michael Weinhold
EIPC Technical Director
European Institute of Printed Circuits
Bourgognestraat 16
P.O.Box 2060
NL-6201CD Maastricht
Office Phone: +31 43 3440872;  Direct Phone: +49 2223 708639
Fax: +31 43 3440873;  Direct Fax: +49 2223 700896

E-Mail: [log in to unmask]
Web: www.eipc.org









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