EMBEDDEDNET Archives

June 2004

EmbeddedNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
John J Felten <[log in to unmask]>
Reply To:
D-37 Sub-Committee Forum <[log in to unmask]>, John J Felten <[log in to unmask]>
Date:
Wed, 23 Jun 2004 09:57:02 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (22 lines)
      Give me a day to look through our study of thermal effects of power
dissipation of embedded resistors. We have lots of photo's. Will be in
touch later.



This communication is for use by the intended recipient and contains
information that may be privileged, confidential or copyrighted under
applicable law.  If you are not the intended recipient, you are hereby
formally notified that any use, copying or distribution of this e-mail,
in whole or in part, is strictly prohibited.  Please notify the sender
by return e-mail and delete this e-mail from your system.  Unless
explicitly and conspicuously designated as "E-Contract Intended",
this e-mail does not constitute a contract offer, a contract amendment,
or an acceptance of a contract offer.  This e-mail does not constitute
a consent to the use of sender's contact information for direct marketing
purposes or for transfers of data to third parties.

 Francais Deutsch Italiano  Espanol  Portugues  Japanese  Chinese  Korean

            http://www.DuPont.com/corp/email_disclaimer.html

ATOM RSS1 RSS2