International Engineering Consortium Announces DesignCon 2005; Issues Call
for Papers; Exclusive Event for Design Engineers Names Cisco Systems Executive
Overall Conference Chair
CHICAGO--(BUSINESS WIRE)--06/30/2004--The International Engineering
Consortium (IEC), producers of a global family of leading design engineering
conferences, has announced that DesignCon 2005 will take place January 31 - February 3,
2005 at the Santa Clara Convention Center in Santa Clara, California.
DesignCon is the premier educational conference and technology exhibition
exclusively for semiconductor and electronic design engineers to examine the
challenges they face in design and verification. The DesignCon conference
program provides updates on the latest technology news and advances affecting
design engineers working at the chip, board and system levels. IEC also announced
that Sergio Camerlo, Director of Engineering at Cisco Systems will preside as
the DesignCon 2005 Conference Chair.
"We're very pleased to have an engineering professional of Sergio
Camerlo's caliber leading our 2005 efforts," noted John Janowiak, Senior Director of
IEC. "A hallmark of DesignCon events, and a strong factor in its success, is
the unique emphasis on education and peer-to-peer exchanges" said Janowiak,
adding that this approach provides an ideal atmosphere for engineers to learn
about state-of-the-art design methodologies and technologies.
To help further its peer-to-peer education focus, IEC recently issued its
Call for Papers for DesignCon 2005. According to Janowiak, engineers
presenting papers at DesignCon will be amongst an elite group of technical
professionals hand-selected to discuss leading-edge case studies, technology innovations,
practical techniques, design tips, and application overviews.
Presentation topics will be diverse and range from Chip-Level Physical
Design and High-Speed Cable Interconnect Design to PCB & Package Technologies and
Passive Component Characterization.
Due to popular demand and to meet the expansion of technology growth
markets, DesignCon 2005 will feature two new special focus areas at the technical
exhibition: the Semiconductor Pavilion and the PCB Technology Pavilion. The
Semiconductor Pavilion will gather companies demonstrating integrated-circuit
products and related technologies. The PCB Technology Pavilion will provide a
showcase for companies demonstrating products to meet the increasingly
sophisticated needs of printed-circuit board designers. To support these exhibits, the
technical program will include conference tracks geared towards these two
subjects.
More information about DesignCon 2005 and its Call for Papers can be found
at http://www.designcon.com.
About DesignCon Events (http://www.designcon.com) DesignCon, DesignCon
East, and Euro DesignCon conference programs provide education and updates on the
latest technology advances affecting design engineers working at the chip,
board, and system levels. The DesignCon technology exhibition delivers practical
approaches, techniques, and procedures directly on the show floor, where
leading-edge displays from key organizations offer proven solutions for immediate
application.
About the IEC (http://www.iec.org) The International Engineering
Consortium (IEC) is a nonprofit organization dedicated to catalyzing technology and
business progress worldwide in a range of high-technology industries and their
university communities. Since 1944, the IEC has provided high-quality
educational opportunities for industry professionals, academics, and students. In
conjunction with industry-leading companies, the IEC has developed an extensive free
on-line educational program. The IEC conducts industry-university programs
that have substantial impact on curricula. It also conducts research and
develops publications, conferences, and technological exhibits that address major
opportunities and challenges of the information age. More than 70 leading
high-technology universities are IEC affiliates, and the IEC handles the affairs of
the Electrical and Computer Engineering Department Heads Association.
CONTACT:The International Engineering Consortium Lynne Bobak, 312-559-3862
[log in to unmask] or Suzanne Ugast, 703-758-1350 [log in to unmask]
SOURCE: The International Engineering Consortium
06/30/2004 16:56 EASTERN
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