View this message on your mobile device
IPC/FED Conference on Embedded Components
4–5 June 2013 · Frankfurt, Germany · Hotel InterContinental Frankfurt
Explore the latest developments in embedded component technology at the IPC/FED Conference on Embedded Components. Designed to bring the entire supply chain together, this conference will provide you with valuable access to industry experts who are advancing embedded components technology, including OEMs, fabricators, assemblers and designers. Receive the valuable information you need on reliability, test, assembly issues and new manufacturing methods in an efficient two-day program in an intimate setting conducive to networking.
In addition, a tabletop exhibition will showcase leading industry suppliers who will be available to answer your questions on embedded components technology. Contact Maria Labriola, IPC sales manager at [log in to unmask] or +1 847-597-2866 for more information.
If you are a designer, manufacturer, supplier or end-user of embedded components technology, this conference is a must.
See you in Frankfurt!
Sincerely,
Stephan Weyhe, Business Manager,
FED
Sanjay Huprikar, Vice President, Member Success,
IPC
Who Should Attend
This event is for engineers, designers, marketers, sales professionals and decisions makers with an interest in embedded components technology. It is applicable to every area of the industry, including:
OEMs
Assemblers
Fabricators
Designers
Suppliers of materials, equipment, CAD and design services
Pricing
IPC/FED Member
Industry Rate
Full Two-day Conference*
€ 620
€ 860
One-day Conference**
€ 340
€ 470
Pricing does not include German VAT of 19%.
Supplier is VMC. Payments should be made to IPC.
* Includes both days of the conference, two networking lunches, networking reception, exhibition and translation services.
** Includes one day of the conference, networking lunch, exhibits and translation services
Translation Services
(most presentations will be in English)
English–German translation services are included in the cost of registration.
Register Now
Hotel Information
The IPC/FED Conference on Embedded Components will take place at:
Hotel InterContinental Frankfurt
Wilhelm-Leuschner Strasse 43
Frankfurt 60329
Germany
€ 169 (single), € 189 (double)
Rate includes VAT, service charge and American breakfast buffet.
Make your reservations by e-mail or call
+49 (0) 69 2605 2444 and state you are with IPC.
REGISTER NOW!
Agenda
Tuesday, 4 June 2013
09:00
Check-in and Exhibits
09:30
Welcome and Introductions
09:45
Embedded Component Technology in Present and Future
Jürgen Wolf, Assistant Manager of Research and Development, Würth Elektronik
10:30
The Progress of Embedded Optical Waveguides in PCBs
Happy Holden, Director of Electronics Engineering and Innovation, Gentex
11:15
Break/Exhibits
11:45
Overview: Introduction in Embedded Technologies
Andreas Ostmann, Group Manager, Embedding & Substrates, Fraunhofer, IZM
12:30
Embedding: An Idea Enters Mass Production
Christian Rössle, Vice President of Sales & Marketing, Schweitzer Electronik AG
13:15
Lunch/Exhibits/Networking
14:45
Requirements for Embedded Components Pick & Place Technology
Eric Klaver, Commercial Product Manager, Assembleon
15:30
Design with and Design for Embedded Components — Electronic Design Process Requirements and Today’s Solutions
Ralf Brüning, Production Manager High Speed Design Solutions, Zuken
16:15
Design and Assembly Process Implementation for Embedding Passive and Active Components
Vern Solberg, Consultant, Invensas
17:00
Reception
Wednesday, 5 June 2013
09:00
Exhibits
09:30
Embedding of Passives and Active Components in a Rigid-Flex Printed Circuit Board
Michael Matthes, Development Engineer, Wittenstein Electronics GmbH
10:15
Embedded Technology and its Introduction in Serial Production
Mike Morianz, Manager, Technology and Innovation Advanced Packaging, AT&S Leoben, Österreich
11:00
Break/Exhibits
11:30
Design Flow for Embedded Actives
Henry Potts, Vice President and General Manager, Mentor Graphics
12:15
The Development of Challenges and Application Reliability for Next Generation Microelectronic and Electronic Products
Paul Wang, VP of Global Quality and Technology Engineering, MiTac
13:00
Lunch/Exhibits/Networking
14:30
Embedded Ultra-Thin Chip Packaging (UTCP) Technology
Jan Vanfletern, Project Manager, IMEC
15:15
Achieving New Levels of Functional Density in Mobile Multimedia Devices Using the Z-dimension
Hemant Shah, Product Marketing Director, Cadence Design Systems, Inc.
16:00
End
or
Forward to a Friend...
This e-mail is from IPC - 3000 Lakeside Dr, Bannockburn, IL 60015. To ensure you receive future e-mails, please add [log in to unmask] to your address book or safe-sender list. If you wish to be removed from further IPC Professional Development/Educational Programs notifications, unsubscribe.
Note: After opting-out, you may receive e-mails that you have specifically requested from IPC. For example, if you make a purchase online, you will receive a transactional e-mail confirming your purchase. Opting out of all e-mails may jeopardize committee participation.
Please DO NOT REPLY back to this message as the mailbox is not monitored and no one will see your reply.
3000 Lakeside Drive, Suite 309S, Bannockburn, IL 60015
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
|
