Dear Colleagues,
As a reminder, the IPC Embedded Passives Users Group will hold a
teleconference on Thursday, June 3 at 1:00 pm standard time. The call
in number is 620-584-8200. The PIN is 1546. Nick Biunno of Sanmina
will present "Advantages of Thin Laminate Buried Capacitance
Constructions for High Speed PCB Applications." The presentation and
the agenda can be found at http://files.ipc.org/epug/2004_06/.
Thanks,
Susan Filz
Manager, IPC Industry Programs