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June 2004

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Subject:
From:
Susan Filz <[log in to unmask]>
Reply To:
D-37 Sub-Committee Forum <[log in to unmask]>, Susan Filz <[log in to unmask]>
Date:
Wed, 2 Jun 2004 10:29:55 -0500
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Dear Colleagues,

As a reminder, the IPC Embedded Passives Users Group will hold a
teleconference on Thursday, June 3 at 1:00 pm standard time.  The call
in number is 620-584-8200.  The PIN is 1546.  Nick Biunno of Sanmina
will present "Advantages of Thin Laminate Buried Capacitance
Constructions for High Speed PCB Applications."   The presentation and
the agenda can be found at http://files.ipc.org/epug/2004_06/. 

 

Thanks,

Susan Filz

Manager, IPC Industry Programs 

 

  

 

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