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June 2005

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Subject:
From:
"DUSL, JOHN (JSC-EV) (ESCG)" <[log in to unmask]>
Reply To:
D-50 Embedded Devices Committee Forum <[log in to unmask]>, DUSL, JOHN (JSC-EV) (ESCG)
Date:
Thu, 16 Jun 2005 13:06:27 -0500
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text/plain
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text/plain (74 lines)
Hello All,

 I will be in test during the telecon today and unable to attend. Sorry for
the late notice.

Thanks,
John Dusl

-----Original Message-----
From: EmbeddedNet [mailto:[log in to unmask]]On Behalf Of Kim Fjeldsted
Sent: Thursday, June 16, 2005 2:11 AM
To: [log in to unmask]
Subject: Re: [EM] IPC D-51 Embedded Devices Design Subcommittee
Conference Call


John,

I will be travelling.  Sorry for the late notice.

D.O.K. (Kim) Fjeldsted, PhD
Vice President Sales and Marketing
Oregon Materials Technologies, Inc.
503.580.0888  Office
503.590.0866  Fax


-----Original Message-----
From: EmbeddedNet [mailto:[log in to unmask]]On Behalf Of John Perry
Sent: Monday, June 13, 2005 7:38 AM
To: [log in to unmask]
Subject: [EM] IPC D-51 Embedded Devices Design Subcommittee Conference
Call


Colleagues,



This is a reminder that the next IPC D-51 Embedded Devices Design
Subcommittee conference call will be this Thursday, June 16th at 4PM
Eastern, 1PM Pacific.  The dial-in number is 1-620-584-8200 and the
passcode is 89542#



I will be posting updated material for the IPC-2316 design guide effort
Thursday morning in advance of the call.  The D-51 detail page is
located at:



http://www.ipc.org/committeedetail.asp?Committee=D-51



Regards,



John Perry

Technical Program Manager

IPC

(W) 847-597-2818

(F) 1-847-615-1705

[log in to unmask]

www.ipc.org

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