----- Forwarded by Dennis Fritz/MacDermid/MACDERMID/US on 09/10/2009 07:18
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|Georgia Tech's PRC <[log in to unmask]> |
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[log in to unmask] |
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|09/10/2009 09:53 AM |
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|Georgia Tech Hosting FREE "Embedded Actives and Passives (EMAP) Webinar - September 11, 2009" |
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A General Announcement to Industry Partners and Potential Partners
Georgia Tech's 3D Systems Packaging Research Center is seeking Industry
participation in five leading-edge industry consortia research programs
which focus on low-cost electronic and bio-electronic systems packaging
technologies for unparalleled system miniaturization, functionality,
performance, and reliability. One such program is Embedded MEMS, Actives
and Passives (EMAP)
Embedded MEMS, Actives and Passives (EMAP) – is a novel technology relating
low-temperature, low-cost and near-hermetic MEMS packaging, cavity
formation in buildup layers made of a new class of low-moisture,
thermosetting organic materials, ultra fine pitch and ultra short
cavity-based “chip-last” interconnections with “chip-first” benefits.
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EMAP II Webinar - September 11, 2009
Join us for a Webinar on September 11
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Space is limited.
Reserve your Webinar seat now at:
https://www2.gotomeeting.com/register/397944507
Hosted by the 3D Systems Packaging Research Center at Georgia Tech
Title: EMAP II Webinar - September 11, 2009
Date: Friday, September 11, 2009
Time: 11:00 AM - 12:00 PM EDT (Atlanta, GA)
After registering you will receive a confirmation email containing
information about joining the Webinar.
System Requirements
PC-based attendees
Required: Windows® 2000, XP Home, XP Pro, 2003 Server, Vista
Macintosh®-based attendees
Required: Mac OS® X 10.4 (Tiger®) or newer
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For further info, please visit: http://www.prc.gatech.edu
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