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August 2004

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Subject:
From:
"J. Obrzut" <[log in to unmask]>
Reply To:
D-37 Sub-Committee Forum <[log in to unmask]>, J. Obrzut
Date:
Fri, 13 Aug 2004 17:43:19 -0400
Content-Type:
text/plain
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text/plain (103 lines)
John, Thanks for the invitation. I have an abstarct that fits,  but I will
not be able to travel twice to California next February.

Regards, Jan
>To all:
>
>         Reminder- Abstracts for DesignCon 2005 are due today. Sessions #5
>and #11 have Embedded Passives as topics. See www.designcon.com for more
>info and to submit your abstracts on-line. Your participation will be
>greatly appreciated.
>
>Best Regards,
>           John
>
>-----Original Message-----
>From: Andresakis, John [mailto:[log in to unmask]]
>Sent: Tuesday, July 06, 2004 12:30 PM
>To: [log in to unmask]
>Subject: [EM] FW: DesignCon 2005 Call for Papers
>
>
>To all:
>
>     This is a follow-up to the email sent by Dennis Fritz last week.
>
>     I am on the technical committee and will be part of the team reviewing
>papers related to PCBs. I want to encourage everyone to consider presenting
>papers on Embedded Passives. DesignCon is a show put on by designers for
>designers and these are the very people we need to get the message too on
>embedded passives. Use the on-line form to submit an abstract. Thanks
>
>Best Regards,
>           John
>-----Original Message-----
>From: Barry Sullivan [mailto:[log in to unmask]]
>Sent: Wednesday, June 30, 2004 1:00 PM
>To: [log in to unmask]
>Subject: DesignCon 2005 Call for Papers
>
>
>Abstract submission deadline: August 13, 2004
>
>The International Engineering Consortium (IEC) is pleased to announce its
>Call for Papers for DesignCon 2005, the leading educational conference and
>technology exhibition for semiconductor and electronic design engineers held
>each year in Santa Clara, California.
>
>
>The IEC is currently accepting abstract submissions in two session
>categories:
>
>
>*       Technical papers (40-minute sessions, February 1-2) addressing
>design case studies and application overviews
>
>*       TecForums tutorials (3-hour sessions, January 31 and February 3)
>covering advanced topics in greater depth and breadth
>
>Fifteen suggested
><http://www.iec.org/cgi-bin/pr.pl?CID=1008494&EC=1501&LN=http%3A%2F%2Fwww%2E
>designcon%2Ecom%2Fconference%2Ftopic%5Fcategories%2Ehtml&POS=1> paper topics
>are available for your perusal. To submit an abstract for consideration,
>please complete the on-line Author
><http://www.iec.org/cgi-bin/pr.pl?CID=1008494&EC=1501&LN=http%3A%2F%2Fwww%2E
>designcon%2Ecom%2Fconference%2Faif%2Ehtml&POS=2> Information Form (AIF).
>
>
>For up-to-date information on DesignCon 2005, visit www.designcon.com
><http://www.iec.org/cgi-bin/pr.pl?CID=1008494&EC=1501&LN=http%3A%2F%2Fwww%2E
>designcon%2Ecom%2F&POS=3> .
>
>
>Best regards,
>
>
>Barry Sullivan
>DesignCon 2005 Conference Director
>[log in to unmask] <mailto:[log in to unmask]>
>
>
>
>   _____
>
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>
>Please email any comments to [log in to unmask] <mailto:[log in to unmask]>
>
>
>
>IEC | 549 W. Randolph Street, Suite 600 | Chicago, IL 60661-2208 USA

J. Obrzut
NIST, Polymers Division
Bldg 224, Rm. B320
Gaithersburg, MD 20899
tel. 301 975 6845

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