----- Forwarded by Dennis Fritz/MacDermid/MACDERMID/US on 09/20/2007 07:15 
PM -----
Here is a call for papers for a conference next spring, including embedded 
components inside Printed Wiring Boards. 

 


Announcement and Call for Abstracts
Topical Workshop on

3D Packaging
This workshop is being held as a part of the Device Packaging Conference

March 17 - 20, 2008

 

Abstract Deadline:  November 30, 2007

 

Technical Chairs:

James J.-Q. Lu

Rensselaer Polytechnic Institute

Troy, NY 12180

Phone: 518-276-2909

[log in to unmask]

 

Christo Bojkov

Maxim-Dallas Semiconductor

Dallas, TX 75244
Phone: 972-371-6149

[log in to unmask]

 

3D Packaging Organizing Committee:

Sitaram Arkalgud, SEMATECH

Flynn Carson, STATS ChipPAC, Inc. 

Kuan-Neng Chen, IBM T.J. Watson Research Ctr. 

Philip Garrou, Microelectronic Consultants of NC 

Morihiro Kada, ASET - Association of Super-Advanced Electronic 
Technologies

Daniel D. Lu, Intel Corporation 

Thorsten Matthias, EVGroup 

Peter Ramm, Fraunhofer IZM, Munich 

Leonard W. Schaper, University of Arkansas 

Paul Siblerud, Semitool, Inc.; Program Director of EMC-3D Consortium 

Lee Smith, Amkor Technology

 

3D Packaging Workshop Focus:

The objective of the 3D Packaging Workshop is to have a unique forum that 
brings together scientists, engineers, manufacturing, academia, and 
business people from around the world who have been working in the area of 
3D Packaging.  This workshop has been specifically organized to allow for 
the presentation and debate of some of the latest and hottest technologies 
out there related to 3D Packaging technologies, as well as to bridge the 
gap between the back-end wafer-level 3D integration and 3D packaging, 
covering wire-bonded chip stack, system-in-packaging (SiP), 
package-on-package (PoP), through-silicon-via (TSV) based die-to-die (or 
chip), die-to-wafer, and wafer-to-wafer 3D approaches.    

 

Attendees and presenters in the past have found that the 3D Packaging 
Workshop is a great opportunity to meet old colleagues and to form new 
relationships with people in the industry.  If you are working in any area 
of electronics packaging or microelectronics, the Workshop on 3D packaging 
technologies would be well worth attending. Abstracts are being requested 
on the following topics:

·   Stacked Die

·   Stacked Packages

·   PWB Embedded Device Technologies

·   Memory Cubes

·   Folded Flex

·   Through Silicon Vias

·   Vertical Interconnects

·   Thin Wafer Processing

·   Assembly Processes and Handling Issues

·   Testing and Probing Challenges

·   Failure Analysis and Reliability

·   Simulation and Modeling

·   Applications and System Requirements

·   Thermal Management

 

The 3D Packaging Workshop will also be organizing an evening Panel Session 
on "Roadmap of 3D Integration and Packaging", on Wednesday, March 19th, 
4:00 pm - 6:00 pm, followed by a reception.

 

Those wishing to present in the 3D Packaging sector of the Device 
Packaging Conference must submit a 200-300 word abstract electronically no 
later than November 30, 2007, using the on-line submittal form at: 
www.imaps.org/abstracts.htm. Please contact Jackki Morris-Joyner by email 
at [log in to unmask] or by phone at 305-382-8433 if you have questions.

 

Device Packaging Exhibit and Technology Show:

IMAPS will hold a concurrent exhibition for vendors and suppliers who 
support the many aspects of 3D Packaging. This venue features an ideal 
atmosphere to showcase your products and services to key decision making 
professionals in the industry. Full 10' by 10' exhibit spaces will be 
available. To reserve booth space please fill out the on-line submittal 
form before February 12, 2008 at: www.imaps.org/devicepackaging or contact 
Ann Bell by email at [log in to unmask] or by phone at 202-548-8717.

 

Device Packaging Professional Development Courses (PDCs):

For those wishing to broaden their knowledge of device packaging, a 
selection of half-day courses will be offered on Monday, March 17th, 
preceding the technical conference. If you would like to participate as an 
instructor, please submit a description of your short course to Jackki 
Morris-Joyner by email at  [log in to unmask] no later than November 30, 
2007.

 

 







Forward email

This email was sent to [log in to unmask], by [log in to unmask]
Update Profile/Email Address | Instant removal with SafeUnsubscribe? | 
Privacy Policy.

Email Marketing by

IMAPS | 611 2nd Street, NE | Washington | DC | 20002