Guess what, Electronic Design Mag just sent me a link to a white paper by VersaLogic
Entitled "Utra Reliable Embedded Computing"
I did not read it yet to determine if there is any real info here but here is a description of what it's about
I assume you can web search this also to get at the white paper if I helps. Not sure I can send this link thru DC forum?
Companies using rugged, extended temperature Commercial Off-The-Shelf (COTS) embedded computers often specify products designed and manufactured to IPC Class 3 requirements. IPC Class 3 requirements are intended to ensure the reliability of electronic products in the most demanding environments. However, with the advent of high density fine-pitch BGA (Ball Grid Array Array) packages, new design and manufacturing challenges arise in meeting IPC Class 3 requirements; at the same time, fully meeting IPC Class 3 requirements is no longer always consistent with providing the most reliable products possible.
This paper describes the challenges faced in meeting Class 3 requirements on PCBs with Fine-pitch BGA packages and provides an overview of a multi-faceted approach to producing ultra-reliable embedded computers.
-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Larry Brophy
Sent: Monday, February 24, 2014 11:05 AM
To: [log in to unmask]
Subject: Re: [DC] Minimum Via size
Tom/Robert,
The PCB supplier I use manufactures to class 3 and provides all the documentation, cross sections and solderability sample as required.
They will have no problem manufacturing the PCB but pointed out that a 4mil laser hole wasn't going to pass Class 3.
So basically it's impossible to design a PCB with a high count mirco BGA on it to Class 3?
As you say the rules are the rules, I just though with the way technology is going, this might have been an area that was under review?
Thanks,
Larry
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