DESIGNERCOUNCIL Archives

January 2005

DesignerCouncil@IPC.ORG

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Subject:
From:
"Mitch S. Morey" <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Fri, 7 Jan 2005 13:21:58 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (146 lines)
Hope it's ok, I'm going to use .41-.425mm for my thru-holes now. "Patents?
We don't need no stinkin' patents..."  :)

Good day.


> -----Original Message-----
> From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Scott
> Nimon
> Sent: Friday, January 07, 2005 11:09
> To: [log in to unmask]
> Subject: [DC] Patent No.: US6,617,529 B2
>
>
> DC members,
>
> I have encountered a patent which any through-hole land patterns with an
> annular ring of >0.4mm and used for lead-free soldering is in violation
> of.  We have used 0.4mm as our standard annular ring for all
> through-hole devices with  hole sizes greater than 1.6mm for years.  A
> link to the patent is provided below.  Are there any IPC documents I can
> use to invalidate this patent?  Any suggestions or comments will be
> welcomed.
>
>
>
> http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL
> &p=1&u=/netahtml/srchnum.htm&r=1&f=G&l=50&s1=6,617,529.WKU.&OS=PN/6,617,
> 529&RS=PN/6,617,529
>
>
>
> Scott Nimon
>
> Yazaki North America
>
> 6801 Haggerty Road
>
> Mail Stop:  2229E
>
> Canton, MI 48187
>
>
>
> Phone:  734-983-2630
>
> Fax:  734-983-2631
>
> [log in to unmask]
>
>
>
>
>
>
> Yazaki North America, Inc. - Confidentiality Notice
>
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