Cheryl,
This is good for SolderPaste.
What do you do for GlueDots - as was originally asked?
<wide grin>
Regards,
James Jackson
Oztronics
-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]]On Behalf Of
Cheryl Johnson
Sent: Wednesday, March 02, 2005 10:40 AM
To: [log in to unmask]
Subject: Re: [DC] IPC 7351 & Glue Dots
I know many define odd shaped solder paste. I still (going down to 0603 and
0402's) define my solderpaste gerber aperture equal to my pad aperture - and
let the stencil manufacturer and assembly house "use what is best for them".
We are a Chinese disk drive manufacturer with millions of volume.
Sincerely,
-----------------------------------
Cheryl Johnson, C.I.D.+
Manager
ExcelStor US Office, Engineering Services
Email: [log in to unmask]
Tel: (303) 684-7291
Fax: (303) 684-7268
Mobile: (303) 809-5815
-----------------------------------
-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]]On Behalf Of Greg
Holley
Sent: Wednesday, March 02, 2005 8:38 AM
To: [log in to unmask]
Subject: [DC] IPC 7351 & Glue Dots
DC members,
Is there any provision for glue dots in the new IPC 7351 land patterns?
Specifically the smaller chip components, 2012(0805)'s. I noticed that the
pad to pad spacing is pretty tight.
TIA
Greg Holley
Dade Behring Inc.
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