Hello to all PCB layout designers:

How does your particular layout system handle the
generation of soldermask pattern and solder paste
stencil pattern for individual SMT parts?

Wherever possible, I have used the outer layer pad
pattern.  But not all parts can be done this way.
Some have special copper features which require
clearance to "layed in" on the masking layers; some
have certain pads or features that should not appear
on the masking layers.  I am trying to find a
"one-size-fits-all" method for generating part
decals (aka footprints or land patterns) that will
work for parts on either side of a board, and allows
designers to use the same CAM process for every
board.  Customizing the CAM for individual boards is
a "nice" feature, and thank goodness we are able to
use it, but it creates a mess for writing
standardized procedures.

I'd like your input and insight; there are so many
brilliant minds from whom one can learn.........even
when we think we already know it all!

Thanks, DJ