Hello all - we have been adding a solder-mask dot on the same side as the IC's with a "GND-SLUG"... no issue... however if a "SLUG" has a large quantity of vias due to the requirement to dissipate heat here is where I have a issue... not enough area for paste and proper solder percentage to the area... so in this case I was suggesting to tent the opposite side that the IC resides on... filling, capping and planarized is the way to go, however would tenting the opposite side be a issue..? note via hole size is 10mils... anyone aware of the IPC standard and or requirement..?

Regard's, Frederick Dark Jr.
Manager Senior PCB Designer
Crestron Electronics, Inc.
22 Link Drive Rockleigh N.J. 07647
P:201.750.7004 ext.11320
F:210.767.5772
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