Hello Everyone, 

The IPC Designers Council is holding their 1st annual Designers Learning Symposium July 16 - 21, 2001 at the Hilton Northbrook Hotel, Northbrook, IL.  Among other exciting areas of interest, this unique event features practical, hands-on training for the designer.  

My question to you is... What topics would spark your interest and fill your work requirements/needs?   

Below is a list of several topics that may be included as part of the hands-on  CAD sessions. It is important that each of the these sessions have depth, that they cover the interrelationships between a number of technologies or factors that may appear on the same board. An example would be a discussion on placement strategies that not only addresses standard technologies but 
addresses the differences between fine pitch surface mount on standard boards to HDI products with a little high-speed thrown in. These sessions should focus on three or four primary items that one wants the designer to retain after the session. 

Please check off your top 4 choices and label them 1st, 2nd, 3rd, & 4th.
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____ Library Development

____ Design Capture

____ Documentation

____ Simulation

____ HDI

____ Routing

____ Prototyping

____ Signal Analysis


 
Topic Descriptions

 
Library Development
 
This session should cover general library management, naming conventions, structure of libraries, automated features of building components, internet availability, etc. Should include any special requirements for newer technologies, such as HDI, blind and buried vias, etc.
 
Design Capture
 
Possible methodologies for capturing a design so that a board may be designed. This includes any multitasking schemes, design and reuse, variations of a  given design, formats, back-annotation schemes, and interoperability. Should address specialized advanced technologies such* RF, High-speed, etc.

Documentation
 
Should cover panelization requirements from the CAD side, MFG tooling requirements, design capture, archiving, Fab, Assy, and test docs. May also include special documentation requirements such as stencil, overlays, solder paste, test specifications, etc.
 
Simulation
 
Types of simulation, when and where used, typical tools for the designer, reports simulation anaylsis tools, etc. Signal integrity, thermal management, etc. What do designers need to know to get up on these tools.
 
HDI
 
Should address various ways in which a HDI may be implemented to our advantage. This may include the use of buried resistors, uVias, and build-up technology to name a few. Should discuss types of editors available, library constraints, 3D editing, floor planning for fine pitch BGA's
 
Routing
 
General description for routing strategies for standard, high-speed, fine pitch, HDI, etc. technologies. Should also include placement strategies, area rules, and generic processing of changes.
 
Prototyping
 
Should include rules for applying electrical, design,thermal, fabrication, and assembly rules. Also included would be a look at field solving tools and techniques. 
 
Signal Analysis
 
A discussion of IBIS/Spice tools, setup and save for future reference and comparisons. How the designer may work with these tools in conjunction with designers. What designers need to know to get up to speed on these tools.

Thank you for your time and hopefully we'll see you at the Symposium! 

For more information contact me (information provided below) or check our web site www.ipcdesignerscouncil.org  and click on "Designers Learning Symposium".

Kindest Regards,

Stephannie Caliendo
IPC Designers Council
Program/Marketing Manager
[log in to unmask] 
847-790-5302

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