Careful Char...you just sent your home phone number to the entire Design
Council.

Tom Amwoza
Westell, Inc.





Charlene Dwyer <[log in to unmask]> on 02/23/99 07:05:24 PM

Please respond to "DesignerCouncil E-Mail Forum."
      <[log in to unmask]>; Please respond to Charlene Dwyer
      <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: Thomas Amwoza/Westell/EIT)
Subject:  Re: [DC] Feb 99 Meeting NIIPCDC




Linda,

I'll try to remember a camera and film.  Do you want to do
the digital camera?  We should be all ready for tomorrow-
I talked with Rachel.  If you need to call me, my number at
home is 630 978-8588 and at work-- 630 759-9500 x 177

-Char




---Linda Gallo  wrote:
>
> The Northern Illinois IPC D.C. will present a
> meeting on Designing for BGA parts.  This will be courtesy
> of Tom Ruberto @ 3COM  Rolling Meadows facility
>
> February 24, 1999.  Time: 5:00 P.M.
>
> Directions to the facility:
> The address of the facility is 3800 Golf Road.
>
> Rachel's  mobile phone number is 773-719-8411, in case
> anyone needs to reach  her that day (or gets lost).
>
> On 290 go north and exit at the Woodfield/to Golf Rd exit.  At Golf
turn
> right
> (east) for about 1/2 mile.  The facility is on the left hand
side(north
> side) of
> the road.  The main entrance is on Golf.
>
>         The  conference room is called "Woodfield-A".
>  People will need to know this when they check in at the reception
area.
>
> Here is the URL for your map:
>
http://www.expediamaps.com/default.asp?C=42.0509440345738,-88.0234482046446
&A=16
>
> &OX=0&OY=0&P=42.0509440345738,-88.0234482046446,1,3800+Golf+Rd
> If your e-mail program supports linked text, you should be able to
> simply click
> on the URL to view a navigable map. If that doesn't work, copy and
paste
> the
> above URL into your Web browser.
>
>
> for further information contact :
>
> Tom Ruberto (847) 222-2078 [log in to unmask]
> or
> Karl @ (630) 713-9853 [log in to unmask]
> or
> Rachel Sheffer (773) 880-2327 [log in to unmask]
>
> BGA Seminar (Preliminary)
> * Industry Trends
> * BGA, The Examination
> Package types
> BGA impact
> Test
> Assembly
> * Design Considerations
> Connect methodology ("The Micro VIA")
> Routing considerations
> Fabrication materials
> Stack-up ("The Board Construction")
> * Q & A rap-up
>
>
> Tom Ruberto Background Info.
>
> Eighteen years experience in Electrical-Mechanical Product Design,
> Manufacturing Engineering, CAD/CAM Technology, and Project Leadership
>
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