I would have to agree that a better way would be to use busbars on the back
of your motherboard.
If it is a 'euro' DIN style motherboard you can get busbar strips that
press fit over the wire-wrap style pins of your mating connectors.
Just some ideas, you may have already considered.

Phil.

At 07:58 21/12/99 -0700, you wrote:
>Happy Holidays,
>I am working on a backplane design that requires the ability to handle up to
>50Amps. This brings to mind alot of questions.
>
>To handle that kind of current I need a trace with a width no less than .82"
>with 2oz material, or  .55" with 3oz material, with a 20 degree C
>temperature rise.
>
>1) What are the ramifications of using 2 or 3oz copper current carrying
>external layers and 1 oz for internal signal layers ie warping, cost,
>manufacturability, hole plating issues.
>
>2) If I use the 2 external layers as planes with 1 or 1.5oz copper, I can
>double the heat disipation area (roughly) and half the current load per
>layer, but then I am concerned about current carrying capacity thru the
>plated holes. What is a minimum number of holes if there were 10 pins
>available at a diameter of .035 to carry the current ( 5 Amps per pin)?
>
>Thanks for your feedback
>

Phil Dutton C.I.D.
Senior CAD Technician
IPC Certified Interconnect Designer
Vision Abell Pty Ltd
Second Avenue, Technology Park,
Mawson Lakes.  SOUTH AUSTRALIA  5095
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