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Subject:	Re: Trace width ratio to pad
From:	John C Laur <[log in to unmask]>
Reply To:	(Designers Council Forum)
Date:	Wed, 27 Jul 2005 15:54:34 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (25 lines)

All,

Wide conductors are great, BUT, wide conductors on a fine pitch QFP can
cause bridging.  In affect you solder mask define the pads with the wide
traces creating solderable surfaces that may be ~4 mils closer than
intended.  It happens when power and ground conductors are set up wider
than the signal conductors.

John Laur
Engineering Analyst Sr, HW
Information Platforms Business (IPB)
Rockwell Automation / Allen-Bradley
1201 South Second Street
Milwaukee, WI.  53204-2496  USA

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