To all,
 
I am on an investigative committee here at Telephonics on the RoHS
initiative. I have been asked by many people what impact, if any, it
will have on the libraries we are using to design the boards. I have
been to several IPC sponsored talks on the lead free issue and I believe
I remember there being a discussion about the pad sizes having to
increase due to the lead free solder paste being less viscous. I can
not, for the life of me, find anything written down on this subject. On
the presentations I have from the meetings I've attended the slides
mentioning this were written as a question (i.e.  "PAD SIZES...WILL THEY
INCREASE?"), to open the group for discussion.
 
Do any of you know of any publication where this is addressed or a white
paper from a company where actual testing had been done?
 
Thank you,
Cathy Bars
 
>^..^<
Catherine Bars CID+
Telephonics Corp.
phone:  631-755-7414
     fax:  631-755-7411
email: [log in to unmask] 
 
 
 
 


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