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April 2009

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Subject:	Re: when do vias require a thermal relief
From:	Don Walker <[log in to unmask]>
Reply To:	(Designers Council Forum)
Date:	Sun, 19 Apr 2009 09:18:13 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (19 lines)

One via application requiring thermal reliefs is when they are used as an
adjunct to a very large mounting pin that requires electrical conductivity.
These large pins often require a great deal of solder and hence heat.
Rather than attempting to connect the large hole to the plane directly, vias
adjacent to the hole are connected to the hole externally then provide the
electrical connection to an internal plane.  These vias are most often
incorporated into the pin padstack footprint directly.

Don Walker

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