> Eric Lucik wrote and I cut
> how close we can place via's to bottom side pads for caps and resistor's. Currently
> we have a horizontal flow with vertical placement of parts running through the wave.
> My IE Dept. wants a minimum of .025" in any direction.
>  Does anyone have a standard that they use or is there a 
> spec that states how far from a bottom side pad a via should be? 

Eric,
Our standard is 0.025" for wave soldered via to pad any direction.
This is copper to copper.
One way to get closer is to allow the soldermask to encroach on
the via pad.  This works for non In Circuit Test vias.

---------------------------
John Laur
Rockwell Automation
Allen-Bradley Co Inc.                 
1201 South Second Street
Milwaukee, WI 53204
+1 414 382 2162 (fax)
+1 414 382 2393 (phone)

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