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Subject:	Gold Removal of surface mount components to be soldered regardless of gold thickness.
From:	Gideon K on Gmail <[log in to unmask]>
Reply To:	[log in to unmask]
Date:	Wed, 30 Jan 2008 23:12:45 +0200
Content-Type:	text/plain
Parts/Attachments:	text/plain (18 lines)

To the forum
As per IPC-J-001 " Gold shall be removed From 95 % of all surfaces of
surface mount components to be soldered regardless of gold thickness". Can I
get advise how this requirement is implemented on Bottom Only Terminations.

Tank you all

Gideon Keren 

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