Hi Edwin:

Pre-baking of flex circuit is a normal process to remove any moisture
before exposing the flex through thermal excursion. Kapton typically
absorbs moisture and may cause delamination during thermal exposure, if
the moisture is not completely removed. Hence, pre-baking process is
necessary to prevent delamination.

Chetan


>Date:         Sat, 16 Jan 1999 09:51:48 +0000
>Reply-To:     "DesignerCouncil E-Mail Forum."
<[log in to unmask]>,
>              Edwin Maximo <[log in to unmask]>
>From:         Edwin Maximo <[log in to unmask]>
>Subject:      [DC] Flex baking
>To:           [log in to unmask]
>
>Hi everyone,
>
>We are an assembly company that uses pre-baking of the flex
>substrates (Kapton and polyimide) as part of our pre-production
>process. We're planning to eliminate this process as part of our cost
>reduction. What will be the effect with regards to its
>assembly and reliability. The flex is use for cameras, is there any
>effect on the type of product it is being used. Are there any
>technical bulletin or standards that will suffice our plan. Any
>inputs regarding this matter will be highly appreciated.
>
>Regards,
>Edwin Maximo
>Value Engineer
>Electronic Assemblies Inc.
>Edwin Maximo
>Value Engineer
>Electronic Assemblies Inc. Phils.
>phone no - (632) 823 7317
>fax no   - (632) 759 8629
>email    - [log in to unmask]
>
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