DESIGNERCOUNCIL Archives

1996

DesignerCouncil@IPC.ORG
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Subject:
Real Small Via's
From:
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>
IPC-D-275 figure 4-9 states to ocmes out from the component body 2 diameters
but not less than 0.03 inch. to the biginning of the bend raduis. The bend
raduis is determined by the lead diameter. up to 0.030 inch, R = 0.030. From
0.030 to 0.047 inch, [...][log in to unmask]
Date:
Thu, 27 Jun 1996 00:02:27 -0400
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To: Gary S. Thomas
From: Chris LaFollette    [log in to unmask]

Hi Gary,
As far as the Micro Electronics Group of AT&T Reading and Allentown PA.
now (Lucent Technologies); minimum via land 25mil / hole size 14mil.
This must be shown with the "hole" toleranced on the Fab drawing with
upper and lower limits ie.: 25-14 +3/-0 .
Check with your friendly fab vendor to comply with the spec.

Best Wishes,
Chris

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