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Subject:	Re: .8mm bga, IPC class 3 design
From:	Andre Demers <[log in to unmask]>
Reply To:	(Designers Council Forum)
Date:	Mon, 11 Jul 2005 14:37:34 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (71 lines)

Hi Frank,

My experience is that if you can't use the minimum required class 3 via as specified in IPC-2222,
then you have to go to Blind or Micro-vias, unless you can fanout the BGA connections
to larger vias that meet class three requirements. (Not possible if your part
has 5 or more rows of balls to connect)

If you go the blind/buried route, then check out IPC-2226,
the Design standard for High Density Interconnect (HDI) boards for more information.

Regards,

Andre Demers, C.I.D.
Senior PCB Designer, Coordinator

cmrsummit Technologies
329 March Road, Suite 203
Kanata ON K2K 2E1
Canada

Telephone: 613.599.3881
Toll Free: 877.428.1229
Pager: 613.368.0506 
Fax: 613.599.7889 

[log in to unmask] <mailto:[log in to unmask]> 
www.cmrsummit.com <http://www.cmrsummit.com/> 




-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]]On Behalf Of Frank
A Bergmeister
Sent: July 11, 2005 2:07 PM
To: [log in to unmask]
Subject: [DC] .8mm bga, IPC class 3 design


I have a design that has a few .8mm bga's on it.  Everything I read says to
use a via with a .018 pad and .008 drill.  I never see what class the
boards are being built to.  My question is ... can PCB manufacturers make a
board with that via to class 3?  We have one manufacturer that wants the
pad .016 over what he drills (+.005 over our drill chart).

What vias are people using for class 3 designs?  Any board manufacturers on
the mailing list?

Any input is welcomed.

Thanks,
Frank

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