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June 1999

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Subject:	Re: 1mm pitch bga dispersion via size
From:	Susan Clayton <[log in to unmask]>
Reply To:	DesignerCouncil E-Mail Forum.
Date:	Fri, 4 Jun 1999 14:34:12 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (49 lines)

We are using a similar part and use a blind 8 mil via with a 20mil pad in the center of the BGA pad going
down to the 3rd layer.  This has been very helpful, and has not been as costly as we thought it would.  We
have had better yields using this method.

Susan Clayton
VMI

Jim Dobbins wrote:

> We have a design that utilizes a 620 ball 1mm pitch bga(6 balls deep / 26
> balls
> wide).
> In the past our dispersion and routing via has been a 25 mil pad, 10 mil
> drill, 35 mil clearance. Our designs are dense and typically utilize
> 5mil traces/spaces. We are still using the 25 mil via as the general
> routing via but looking for recommendations/examples of what folks are using
> for dispersion on 1mm bga s.
> Thanks,
> Jim
>
> ---------------------
> Jim Dobbins
> Tel:     (408) 530-4700 Front Desk
> Tel:    (408) 530-4745 Direct Line
> Email:  [log in to unmask]
>
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