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March 2006

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Subject:
Via reliability
From:
Adam Smith <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Thu, 30 Mar 2006 04:33:08 -0800
Content-Type:
text/plain
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text/plain (23 lines) 
Hi,

Does anyone have any guidelines (or good references) that discuss the
number thermal cycles versus temperature swing for various plated
through hole aspect ratios and laminates? 


Adam Smith, CID
IR Halifax
7020 Mumford Rd
Halifax NS B3L 4S9
902.431.1644 x262
 

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