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January 2008

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Subject:
From:
Fred Dark <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Tue, 8 Jan 2008 18:51:54 -0500
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Hi All - I'm looking for some insight on layout with a .4mm BGA that
will keep cost down... we are currently using via in pad (4mil
drill\10mil pad)... if anyone has a way of setting up a stackup and the
use of blind and buried vias, could you give some pointers...?
 
The chip being used is Texas Instruments "TI_TWL4030"... Has anyone used
this chip in a design..? the piece price per board was shocking..!
 
Regard's, Fred Dark Jr.

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