Allen,

I don't have any articles to back up my statements but pads having the
same width as trace causes no soldering issues at all. If you consider
most of solder accumulates at the device side part of the pad, you'll
see there is no issue. The solder fillet forms quite nicely.  

Cheers,

Ron Scott C.I.D.
Sr. PCB Designer
Texas Instruments
Storage Products Group
Tel: 214.567.4715  
Cell: 972.816.7978
Fax: 972.761.5070
[log in to unmask]

 


-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of
Allen T. Maddox
Sent: Wednesday, July 27, 2005 13:47
To: [log in to unmask]
Subject: [DC] Trace width ratio to pad

Hey Folks,
 
I was always told to NOT exit a pad, especially a SMT pad, with a trace
the same width of the pad for the reason of dissipating the heat off the
pad and creating soldering issues.
I have an engineer who doesn't believe me and wants proof. Does anyone
have any articles that support what I've been taught, or have I been
mislead all these years?
 
Thanks,
 
 
Allen Maddox C.I.D.
Sr. PC Board Designer
GAI-Tronics, Corp
610-796-5854
PO Box 1060
Reading, PA 19607-1060
 
[log in to unmask]
www.gai-tronics.com


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