Fellow Designers;

The IPC Designers Council Education committee has completed the objectives
for the High Speed Design Focus Module. These objectives will be used to
create a study guide, and eventually the questions for the examination. We
wish to share these objectives with you, and solicit your comments. Comments
should be constructive, and include recommendations for improvement,
inclusion, or exclusion. The objectives will cover the ten major subject
areas: 

Layout
Electrical considerations
Material properties
Component requirements
Assembly technology
Board fabrication
Physical board requirements
Documentation
Inspection test
Reliability

In addition, we ask for any technical inputs for inclusion in the study
guide. You may believe that there are critical issues that need to be
covered, and this information is extremely valuable to us. We will accept any
input from a finished paragraph to an outline of critical issues.

Comments should be sent to Hugo Scaramuzza at [log in to unmask]


Layout

1H.1 Planning and Layout Strategy
1H.2 Circuit Analysis
1H.3 Component Placement
1H.4 Conductor Routing/Critical Length
1H.5 Decoupling Networks
1H.6 Impedance Modeling &Control
1H.7 Termination Implementation
1H.8 Loading Issues
1H.9 Crosstalk & EMI Control
1H.10 Power Distribution Implementation

Electrical considerations

2H.1 Basic Electronic Theory
2H.2 High Speed Definition
2H.3 High Speed Concerns and Issues
2H.4 Effective Operating Frequency
2H.5 Signal and Wave Propagation
2H.6 Signal Attenuation
2H.7 Crosstalk and EMI Theory
2H.8 Impedance Control and Reflection
2H.9 Power Distribution Theory
2H.10 Capacitive/Transmission Lines
2H.11 Termination Characteristics

Material properties

3H.1 Materials and Relative Permittivity
3H.2 Physical Material Properties
3H.3 Material Selection Trade-offs
3H.4 Hi-Frequency vs CTE materialsGlass 
3H.5 Transition Temp. Impact

Component requirements

4H.1 I/C Logic Families and Edge Rate
4H.2 Connector Systems
4H.3 Resistive Elements and Components
4H.4 Component Selection Issues

Assembly technology

5H.1 Component Attachment Implications
5H.2 Conformal Coating Characteristics

Board fab

6H.1 Production Core vs Prepreg
6H.2 Power and Ground Plane Alignment
6H.3 Lamination Techniques & Effects
6H.4 Copper Thickness/Surface Control

Board physical requirements

7H.1 Microstrip Transmission Line Board
7H.2 Embedded Microstrip Trans. Line
7H.3 Single Stripline Transmission Line
7H.4 Dual Stripline Transmission Lines
7H.5 Board Structure Analysis

Documentation

8H.1 Impedance/Equation Analysis
8H.2 Conductor Width/Spacing Analysis
8H.3 Printed Board Structures
8H.4 Layer Definition and Tolerancing

Inspection/test

9H.1 Coupon Design and TDR Testing 
9H.2 Microsection Analysis
9H.3 Design for Test Principles

Reliability

10H.1 Performance Characterization
10H.2 Thermal Management and effects






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