Hello Designers:

Is anyone familiar with having PCB outlines punch-cut out of the panel?  I'm 
interested in knowing if there are specs (additional tol needed around board 
edge etc.) and quality concerns based on using hi-temp, gold bondable FR4 
mat'l that's .024" thick.  The attachment process would be wire-bonding to 
bare die on board, if that raises any further concerns.  Thanks for your 
feedback.

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