Jerry, 
Refer to specification IPC-SM-840, Qualification & Performance of
permanent Solder Mask. This has a specific section on visual & physical
requirements and adhesion.
Thanks
Tony Cosentino
Tekelec - PCB Engineer
[log in to unmask]
  

-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of
[log in to unmask]
Sent: Wednesday, July 13, 2005 6:33 PM
To: [log in to unmask]
Subject: [DC]

Hi 

 

 

I have an engineer who is concerned about uniform thickness of solder
mask over pad (sharp and well-defined edge), and good adhesion of the
solder mask material to the pad (so solder won't undercut it), and
removal of residues. This is in the 1mm BGA pad using a dog bone
breakout.

 

So what I was wondering is what IPC doc would give me some information
and if any of you have any info.

 

Thanks

 

 

Jerry Johnson

 

PC Design Process and Tools Engineer

Agilent Technologies, Inc

1900 Garden of the Gods Road    Telephone: 719-590-2231

Colorado Springs, CO            Email:  [log in to unmask]

 


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