Dear collegues ,
We are developping a designrulebook for design for manufacturing of
Au Thin Wire Wedge/Wedge and Ribbon Bonding especially for High Frequency
Applications.
Is there anyone, who knows designrules for DFM for similar or other
wire/ribbon bond applications coming from the Chip on board technology. May be that there still exists a structure for such a Designrulebook.
I think it makes sense to work together in a userforum on this matter.
Is there anyone who is interested in this matter ?
Thank You very much
M. Jeremias
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