I'm playing with some small featured chips and want to create a footprint for a .4mm pitch chip with 64 copper pillars rather than solder balls.
I can't find a recommendation for the land pattern... not one that makes sense anyway... :)
How would you approach creating a producible, useful, land pattern for this type of chip?
What clearance would you use for the soldermask around the copper pillars and their lands...
I'm using lead free solder... SAC305.
Thanks in advance for any advice you may have... :)
http://www.topline.tv/drawings/pdf/eWLP/eWLP64T.4-DC088D.pdf
William Brooks, CID+
Printed Circuit Designer
Nordson Asymtek
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Carlsbad, California 92010-6603 USA
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