NORTH TEXAS CHAPTER

                                    IPC DESIGNERS COUNCIL

                             MAY MEETING ANNOUNCEMENT

       Next Meeting: Regular meeting May 16

       Location: Taffy’s Restaurant @ Coit & Round Rock in Richardson

       Topics: High Speed Design & Signal Integrity; Component
Identification

       Our regular May meeting has been moved out to May 16th so that we
may have a special
       presentation by Lee Ritchey who will be speaking on the subject
of High Speed Design and
       Signal Integrity. The meeting begins at 6 p.m. and is also in a
different location this time as the
       Texans building was not available at TI. This regular chapter
meeting will be held at Taffy’s
       Restaurant located at the intersection of Coit Road and Round
rock in Richardson.

       The meeting will get started at 6 p.m. with the IPC video
presentation on Component
       Identification. This video will lead the viewer through various
levels of component identification
       based on salvaging a doomed spaceship. Food is normally sponsored
at our meetings,
       however, Taffy’s is an order-off-the-menu restaurant and everyone
will be responsible for the own
       meals during this meeting.

       We were very fortunate to be able to adjust our schedule to have
Lee Ritchey present his “High
       Speed Design and Signal Integrity” lecture that will begin after
dinner around 7 p.m. Lee is
       currently in the middle of two projects that he will address
regarding EMI failures from the lead
       frames of QFP packages and cheap BGA packages. He will discus
this packaging in general
       and also discusses some of the problems and possible long-term
solutions for them. Richey will
       also talk about differential signals in general and how they
affect impedances, cross talk and
       signal integrity, including the esoteric problems encountered
with differential signals at 2.5GB/s.

       Ritchey is no stranger to the IPC Designers Council and he brings
a wealth of design
       background and knowledge to share with us. Ritchey holds a
B.S.E.E. degree and was most
       recently the Director of Electronic Packaging Engineering for the
Network Systems Division of
       3Com Corporation. Formerly, he was the Vice President of
Engineering and Marketing and a
       cofounder of Shared Resources. He has more than 25 years of
experience in the packaging of
       high-performance equipment ranging from microwave satellites to
supercomputers and is
       currently working with major suppliers of gigabit and beyond
Internet products as well as a
       variety of wireless products. He has been a member of the IPC
Advanced Packaging
       Committee and has served as a packaging engineer consultant to
several developers of high
       performance computers, image processors, and workstations.

     For More Info Contact:  Paul Olson, Publicity Officer, North Texas
IPC Designers Council, 512-431-3300.