Alexis,
If you use via-in-pad, it must be a filled via or it will leave a sink in 
the pad and even then manufacturing may have soldering issues. If the via is 
filled manufacturing will have soldering issues. we tried this technology in 
0603 and 0805 pads with a 10mil through hole and abandoned it because the 
cost of filled vias and the manufacturing soldering problems.

Ray Johnston
Rane Corporation
425-355-6000
rayj@rane,com


----- Original Message ----- 
From: "Alexis Meehan" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, January 28, 2009 6:59 PM
Subject: [DC] Via-In-Pad


> One of our engineers has asked if we can implement via-in-pad on a handful 
> of 0603 pads to facilitate routing of critical lines. We've never done it 
> here before, and I know that it increases both fab and assembly costs. I'm 
> also concerned about the risks involved (trapped solvents, rising via 
> plugs, etc). Has anyone out there used this technology on only a few 
> components with success (and minimal problems)? I'm not sure if we should 
> be doing this on a layout spin that needs to be our production version. 
> Thanks in advance for any feedback.
>
> Alexis Meehan
> Opnext Subsystems, Inc.
> Desk: 408-385-3040
>
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