DESIGNERCOUNCIL Archives

September 1998

DesignerCouncil@IPC.ORG
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Subject:
And another thing...
From:
Chris Ball <[log in to unmask]>
Reply To:
DesignerCouncil E-Mail Forum.
Date:
Thu, 24 Sep 1998 09:03:58 -0400
Content-Type:
text/plain
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text/plain (21 lines) 
Yo.

Anybody got any idea how much growth in the height of a component to allow
for after reflow (solder thickness under component)? We have some extremely
tight package profiles and have never really addressed this.

Still,
-Chris Ball-

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