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| Reply To: | (Designers Council Forum) |
| Date: | Thu, 5 Jul 2012 11:29:22 -0700 |
| Content-Type: | text/plain |
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Cool.. not a bad idea. :)
Bill Brooks | Datron World Communications, Inc.
PCB Designer/Engineer | Office: 760-602-7004| Fax: 760-597-3777 | [log in to unmask]
3055 Enterprise Court, Vista, CA 92081 | www.dtwc.com
Performance You Require. Value You ExpectTM
-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Di Marcello Paul
Sent: Sunday, July 01, 2012 11:45 PM
To: [log in to unmask]
Subject: Re: [DC] Removing identifying marking on chips after assembly?
Can't help here, with a proper and complete solution, but we have to lacquer our products a lot of the time for intrinsic safety clearances.
If a sufficient quantity of lacquer is sprayed over the chips it hides the marking, and scraping the lacquer off often results in the scraping off of the marking too.
Paul Di Marcello
Technical Design Engineer
Pepperl+Fuchs srl
-----Original Message-----
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Brooks, Bill
Sent: venerd́ 29 giugno 2012 18.05
To: [log in to unmask]
Subject: [DC] Removing identifying marking on chips after assembly?
Sometimes there is a requirement to remove the marking on a chip after assembly or even before assembly.
What sort of issues come from this activity?
Is there a company that is expert at doing this that could contract to do this?
If we did it in house, what equipment and expertise would we need?
Where should I look to for advice?
Bill Brooks | Datron World Communications, Inc.
PCB Designer/Engineer | Office: 760-602-7004| Fax: 760-597-3777 | [log in to unmask]
3055 Enterprise Court, Vista, CA 92081 | www.dtwc.com Performance You Require. Value You ExpectTM
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