Greater Phoenix Designers Council Meeting
Tuesday January 11th, 2005
Lead Free Investigative solutions to make the transition 

Time:
6:00 -- 6:20 PM -- Food and Drink
6:20 -- 6:30 PM -- Introduction and announcements
6:30 -- 8:00 PM -- Presentation
8:00 -- 8:30 PM -- Q&A

!! NOTE: NORMAL GDDS MEETING LOCATION !!
--- This will the last meeting held at GDDS ---

Place:
General Dynamics Decision Systems
8201 E. McDowell Road
Scottsdale, AZ
View Map -
http://dcchapters.ipc.org/phoenix/gpdc/chapter/phxchapter.html

Presentation Description:

LEAD-FREE Investigative solutions to make the transition 

As we embrace the Worldwide Directives to eliminate Lead from electronic
assemblies, we'll investigate the materials and process changes
necessary to successfully make the transition.

----------------

About the Presenter:
Terence C. Regan - Terence has been involved with PCB technology for 22
years including Military / Aerospace and Commercial fabrication and
assembly. He also has been a Principal Manufacturing Engineer for two
OEMs with High-Rel and High Volume manufacturing. Terence has a BS in
Industrial Technology from San Jose State University.
For further information concerning the lead free directives, please
visit the
<http://www.tycoelectronics.com/environment/leadfree/default.stm> Tyco
Electronics Lead Free Web Site.

For Tyco Electronics Lead-Free product solutions see -
<http://catalog.tycoelectronics.com/TE/bin/TE.Menu?M=LEADFREE&LG=1&I=13>
Lead Free Solutions 
For Tyco Electronics Lead-Free product Definitions see -
<http://catalog.tycoelectronics.com/TE/english/leadfreecompliance.html>
Lead Free Compliance Definitions 
 
IPC's Lead-Free Website- http://leadfree.ipc.org/
 
------Snip from Circuit Assembly below
*	
Process Evaluation
Pb-Free  <http://www.circuitsassembly.com/pdf/0412/0412collier.pdf>
Manufacturability and Test Control
Lead-free solder is not a drop-in replacement electrically or
mechanically. Determining the "sweet spot" between electrical contact
and mechanical deformation.
Terence Q. Collier

*	
Cover Story
Assessing Solder
<http://www.circuitsassembly.com/pdf/0412/0412henkel.pdf> Joint
Reliability in Pb-Free Assemblies
A study finds distinctions between predictors of reliability for leaded
and lead-free alloys.
Steve Dowds

RSVP to:
Cyrus Ringle CID +
IPC Advanced Certified Interconnect Designer
CAD Engineer
Inter-Tel, Inc. http://www.inter-tel.com
7300 W. Boston St.
Chandler, AZ 85226
(480) 961-2263
mailto:[log in to unmask]
President of the Greater Phoenix Designers Council
http://dcchapters.ipc.org/phoenix/



 


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