I add external copper pours to a large percentage of my designs,
and have seen only advantages, never any disadvantages.

My only comment is that even though my design rules might be set
for a small clearance trace to trace (4 mils, 5, 6?), if it's just
a shield plane or theiving (not the main power plane) I try to set
the gap larger for easier manufacturing, maybe 10-20 mils

good luck,
Jack





Kitty Hines <[log in to unmask]>@IPC.ORG>
12Aug2002 09:05 AM

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Subject:  [DC] copper thieving
Retain Until: 09/11/2002 Retention Category: G90 - Information and Reports
Caterpillar Confidential:  Green


Hi,
I've been advised by the board house to add copper thieving to the outer
layers of a design we've sent them for manufacturing.  I understand they
need to add copper in bare areas to allow them to plate evenly across
the board.  We're considering a copper pour as opposed to sporatic field
oof copper squares...any suggestions, advice, comments?
Thanks for your input,
Kitty

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