Alexandra Curtis,

Can You tell us, where on the  homepage www.ipc.org the registration  for
the  Wbcast is  available

Sincerely
Michael Jeremias

-------------------------------------------------- 
Industrial Engineering (OPP41)
im Auftrag / authorized by
EADS Deutschland GmbH
Systems & Defence Electronics
89070 Ulm

Tel:          + 49 (0)  731 392 5533
Fax:         + 49 (0)  731 392  7315
E-Fax:     +  49 (0) 731 392 20 5533
E-mail:    [log in to unmask]


EADS Deutschland GmbH
Industrial Engineering (ASP41)
Wörthstrasse 85
D  89077  Ulm  
Germany

homepage
http://www.eads.net

-------------------------------------------------------

-----Ursprüngliche Nachricht-----
Von: Alexandra Curtis [mailto:[log in to unmask]]
Gesendet: Dienstag, 3. Februar 2004 23:46
An: [log in to unmask]
Betreff: [DC] IPC Webcast on BGA Updates


IPC BGA Update
Changes in IPC-7095 reflecting the Latest in BGA Implementation Strategy 
Tuesday, February 10, 2004
10:00 a.m. - 11:00 a.m. (CST)

Today's electronic equipment uses very complex parts which relate to board
design and assembly issues.  Assembly is concerned about attaching all the
leads to the mounting structure without bridging (shorts) or missing solder
joints (opens).  Design is concerned with interconnecting all the leads and
having sufficient room for routing conductors. Quality Control is concerned
about the methods of inspection and process qualification.

This webcast addresses all the concerns that have been expressed by the
industry and have been documented in the proposed revision A of IPC-7095.
Originally released in August of 2000 many of the additions deal with the
strategy for "Design and Assembly Process Implementation for BGAs". The
webcast is a must for those contemplating using BGAs to those having to make
the processes that produce high quality assemblies.

Participants will have a unique opportunity to obtain firsthand information
on the updates now going through final ballot approval and comprehending the
issues that affect BGA and FBGA assembly. The new sections deal with
expanded information on Surface Finishes, X-ray inspection and the
evaluation of voids in the solder ball or at the interface of the part or
mounting surface.

If you're thinking: "Come-on, there's no way you can cover all the questions
that an individual might have about BGA implementation in one hour!" You'd
probably be right...with one exception: the update is being presented by
Dieter Bergman, IPC Director of Technology Transfer.

This year Bergman will have been on the IPC staff for 30 years. He has been
involved with the development of virtually every design standard, guideline
or document developed by IPC. In the last two years he has worked with the
dedicated BGA task group members under the Chairmanship of Ray Prasad to
incorporate the latest thinking into the IPC-7095 on BGA technology. In
January he met with members of the IPC-A-610 committee to make certain that
the requirements of BGA implementation and those of the workmanship standard
on Assembly evaluation and acceptance were in harmony. All of the new
agreements will be explained in the webcast.

Topics covered in the presentation include: 

* Challenges for implementing BGA and Fine Pitch BGA technology
* Effect BGA and FBGA have on current technology
* New techniques for X-ray inspection
* Focus on critical repair, and reliability issues associated with BGAs
* Acceptance and how to determine the reliability of the assembly and
attachment processes 
* How to determine when voids are detrimental to long term performance
* What issues can be handled under process control procedures 

For more information or to download the registration form, go to www.ipc.org
or contact Alexandra Curtis at 847-790-5377.

----------------------------------------------------------------------------
-----
DesignerCouncil Mail List provided as a free service by IPC using LISTSERV
1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF DesignerCouncil.
To set a vacation stop for delivery of DesignerCouncil send: SET
DesignerCouncil NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases >
E-mail Archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 ext.5315
----------------------------------------------------------------------------
-----

---------------------------------------------------------------------------------
DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF DesignerCouncil.
To set a vacation stop for delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------