Charles,
You didn't state if you wanted it as performance classes or design, so I sent them both. This is a cut and paste out of our DFM guide lines.
Regards,
Ted
Performance Classes
Class 1 General Electronics Products
Includes products suitable for applications where the major requirement is the function of the completed assembly.
Class 2 Dedicated service electronics products
Includes Products where continued performance and extended life is required, and for which uninterrupted service is desired but not critical. Typically the end use environment would not cause failures.
Class 3 High performance electronic products
Includes products where continued high performance or performance on demand is critical, equipment downtime can not be tolerated, end use environment may be uncommonly harsh, and the equipment must function when required, such as life support or other critical systems
Design Classes
Class 1: General design complexity. Components typically placed on a .5mm grid (if for some reason the design has to be in inches use a .100" grid.); trace width and spacing .2mm/.007 inch or more. FR-4 material, 4 layers or less, no fine pitch parts, through hole vias <.25mm (.010"), no buried or blind vias, no controlled impedance tracks and no parts on the secondary side of the pcb. IPC type 1 class A-C
Class 2: Moderate/standard design complexity. Components placed on .05mm grid (if for some reason the design has to be in inches use a .025 inch grid), a maximum of two traces between IC lands Designed trace width and spacing .13mm (.005 inch.), FR-4 material, 6 layers or less, some fine pitch parts and or BGAs, through hole vias ˜.25mm (.010"), no buried or blind vias, no controlled impedance tracks and some discreet parts on the secondary side of the pcb. IPC type 1 class X,Y, type 2 class B-C
Class 3: High design complexity: Surface mount pads of.5mm (0.020" pitch) or less. Components placed on .05mm grid (if for some reason the design has to be in inches use a .025 inch grid), a maximum of two traces between IC lands, designed trace width and spacing .102mm (.004 inch.), FR-4 material, Rodgers, Getek , 6 layers or more, mostly fine pitch parts and or many BGAs, through hole vias ™25mm (.010"), buried or blind vias, controlled impedance tracks, discreet and IC's on the secondary side of the pcb. IPC type 1 class Z and 2 class C-Z
Class 4: These designs are outside our stated manufacturing capability. A production quote is provided once the dedicated DFM resources have reviewed the design.
Quoting Charles Gervasi <[log in to unmask]>:
> Does anyone know where I could find a summary of the differences between
> IPC Class 2 and 3?
>
> Thanks!
>
> CJ
>
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