DESIGNERCOUNCIL Archives

December 1997

DesignerCouncil@IPC.ORG

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Subject:
From:
"Buscomb, Scott" <[log in to unmask]>
Reply To:
DesignerCouncil Mail Forum.
Date:
Thu, 4 Dec 1997 10:32:50 -0500
Content-Type:
text/plain
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text/plain (54 lines)
There can be many possibilties. Check the vendor recommendations for oven
profiles and land pattern. Are you breaking the board out of the panels
by hand or using a post assembly score finishing machine (after-score)?
Try testing the boards before you break them out. The part is being
stressed, but where?

Scott

 ----------
From:  DesignerCouncil Mail Forum.
Sent:  Thursday, December 04, 1997 10:21 AM
To:  DesignerCouncil
Subject:  [DC] SMD Capacitor Cracking

We are a company new to SMT and are working on a design in which a  500V
Ceramic capacitor with a 1206 pkg. size has an initial 115VAC input
voltage applied to it. On 50% (5 of 10) units tested, the capacitor "blew
up" (The design works on the 5 that didn't "blow up").  We are no where
near the limits of the device and believe that the capacitors are
cracking at some point in the assembly process. What I am looking for is
all the possibilities for this occurrence.
Some additional info: the board size is .407"x2.075", FR4, .031 thick,
single sided. Assembled in a 7x4 array (28up), scored, panel size
3.5"x8.9". Placed in the reflow oven, the capacitor goes in last (at end
of PCB). Thank You in advance!

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