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June 2001

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Subject:
And another thing?
From:
Matthew Lamkin <[log in to unmask]>
Reply To:
DesignerCouncil E-Mail Forum.
Date:
Thu, 14 Jun 2001 14:01:38 +0100
Content-Type:
text/plain
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text/plain (21 lines) 
Hello Again,

Should I (if there is room) place any groundplane (tied to 0v below)
underneath a MQFP208 chip, on the top copper/SMT side?

Or would this absorb some of the heat when it is being heated, and
consequently cause it to have poor solder connections?
(amongst all the other reasons for there being poor soldered joints ;-))

Matthew Lamkin.

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