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1996

DesignerCouncil@IPC.ORG

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Subject:
From:
Mike McNulty <[log in to unmask]>
Date:
Thu, 25 Jan 1996 10:26:04 -0500
Content-Type:
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One method to transition controlled impedance lines from layer to layer is 
to form a coaxial line where the center via is your transmission line 
which is then surrounded by a ring of ground vias. Ground via diameter is dictated
by the dielectric constant of your substrate material.



 \_\_\_\_\_\_\_\_\_\_\_\_\_\_\_\_
 \_   Mike McNulty             \_
 \_   Lockheed Martin GES      \_
 \_   Moorestown NJ            \_
 \_   Phone:(609)722-7323      \_
 \_   Fax:(609)722-2207        \_
 \_   [log in to unmask]   \_
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*****************************************************************************

does anyone have any data concerning 50 ohm transmission lines
starting on the first layer and using vias to transport it to an inner layer.
I have looked at the IPC specs concerning microstrip etc.  good info.
unfortunately it just doesn't mention anything about how to get a 
impedance controlled line from one layer to the next.  I know that 
someone out there has done the numbers or knows where to go to
get them.  Please let me know 

thanks in advance.




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