DESIGNERCOUNCIL Archives

1996

DesignerCouncil@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
DES. (fwd)
From:
Lisa Williams <[log in to unmask]>
Date:
Wed, 27 Mar 1996 14:14:22 -0600 (CST)
Content-Type:
TEXT/PLAIN
Parts/Attachments:
TEXT/PLAIN (28 lines) 


---------- Forwarded message ----------
Date: Tue, 19 Mar 96 09:32 EST
From: Mike Cussen <[log in to unmask]>
To: [log in to unmask]
Subject: DES.


 The layout group wanted me to ask the TechNet group this question.

 We are in the process of designing a circuit board that will be two 
 layers, SMT, and FR4 material. We have one SO8 package that will be getting
 a bit warm due to the design. One side of this SO8 package, has four
 pins of the same net, the designer would like to tie all these pads to one
 large ground pad. They are concerned about thermal relief and the reflow 
 process. What kind of problems may we have?

 Michael Cussen
 Medar Inc.
 [log in to unmask]


 

ATOM RSS1 RSS2