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April 2008

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Subject:
From:
Stephen Hankins <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Tue, 1 Apr 2008 15:49:25 -0700
Content-Type:
text/plain
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text/plain (31 lines)
I am currently working on a design that will use Hot Bar soldering to
fasten a flex circuit to one edge of my pcb.
My question, to anyone familiar with this technique, is how close can I
place adjacent surface mount components that will have already been
reflowed in place?
 
I've been told that the area directly under the area to be pulse heated
will have to remain free of components, to make sure of flatness in the
jig, but no information was given regarding where the keepout area ends.
Most articles on the web talk about the actual soldering and not design
parameters surrounding the area.
 
Thanks in advance,
Stephen Hankins
PCB Design
Xantech Corp.
Sylmar, CA.
818 362-0353 x255
 
 
 

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